Industry trends, simulation-guided optimization, and hotspot-aware zoned cooling for high-power Artificial Intelligence (AI) chips

: Material Science & Engineering International Journal
: Ved Dwivedi,^1,2 Balraj S. Mani,³ Nuggehalli M. Ravindra^1,4

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Keywords

thermal management, AI accelerators, direct to chip liquid cooling, integrated heat spreader, ANSYS® mechanical, parameter sweep, hotspot-aware zoned cooling, graph neural network, gated recurrent unit, cyber-physical systems.

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Industry trends, simulation-guided optimization, and hotspot-aware zoned cooling for high-power Artificial Intelligence (AI) chips

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