Industry trends, simulation-guided optimization, and hotspot-aware zoned cooling for high-power Artificial Intelligence (AI) chips
- Material Science & Engineering International Journal
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Ved Dwivedi,<sup>1,2</sup> Balraj S. Mani,<sup>3</sup> Nuggehalli M. Ravindra<sup>1,4</sup>
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Keywords
thermal management, AI accelerators, direct to chip liquid cooling, integrated heat spreader, ANSYS® mechanical, parameter sweep, hotspot-aware zoned cooling, graph neural network, gated recurrent unit, cyber-physical systems.
